Improved Stability of 4H Sic-MOS Devices after Phosphorous Passivation with Etching Process
نویسنده
چکیده
Phosphorous passivation of the interface (4H-SiC/SiO2) improves interface trap density (Dit) from 10 13 eV -1 cm -2 to 2×10 12 eV -1 cm -2 at 0.2eV below the conduction band edge of 4H-SiC. Due to the formation of phosphosilicate glass (PSG) layer during P passivation, metal-oxide-semiconductor capacitors (MOS-Cs) are highly unstable. Under bias-temperature stress (BTS) there is very large shift in the flatband voltage, VFB, (independent of the bias polarity) of MOS-Cs. In this paper we proposed a new method to improve the stability of these devices. The PSG layer formed after passivation is etched-off in buffered oxide etch (BOE) and then capped with deposited oxide. Devices fabricated with this process showed Dit of 4x10 12 eV -1 cm -2 , and are stable after BTS test performed at 150 o C, +1.5MV/cm. This value of Dit is as good as the-state-of-the-art NO/N2O passivated MOS-C. Also, XPS indicated the presence of P at the interface after etching which explains “NO/N2O –like” Dit for etched PSG MOS-Cs.
منابع مشابه
Characterization of Large Area 4H-SiC and 6H-SiC Capacitive Devices
SiC based capacitive devices have the potential to operate in high temperature, chemically corrosive environments provided that the electrical integrity of the gate oxide and metallization can be maintained in these environments. We report on the performance of large area, up to 8 x 10 -3 cm, field-effect capacitive sensors fabricated on both the 4H and 6H polytypes at 600°C. Large area capacit...
متن کاملSiC Field-Effect Devices Operating at High Temperature
Field-effect devices based on SiC metal-oxide-semiconductor (MOS) structures are attractive for electronic and sensing applications above 250°C. The MOS device operation in chemically corrosive, high-temperature environments places stringent demands on the stability of the insulating dielectric and the constituent interfaces within the structure. The primary mode of oxide breakdown under these ...
متن کاملSuppression of 3C-Inclusion Formation during Growth of 4H-SiC Si-Face Homoepitaxial Layers with a 1° Off-Angle
We grew epitaxial layers on 4H-silicon carbide (SiC) Si-face substrates with a 1° off-angle. The suppression of 3C-inclusion formation during growth at a high C/Si ratio was investigated, because a growth technique with a high C/Si ratio is needed to decrease residual nitrogen incorporation. 3C inclusions were generated both at the interface between the substrate and epitaxial layer, and during...
متن کاملHigh-responsivity SiC Ultraviolet Photodetectors with SiO2 and Al2O3 Films
Silicon carbide (SiC) has shown considerable potential for ultraviolet (UV) photode‐ tectors due to its properties such as wide band gap (3.26 eV for 4H-SiC), high break down electric field and high thermal stability. 4H-SiC-based UV photodetectors such as Schottky, metal-semiconductor-metal (MSM), metal-insulator-semiconductor (MIS) and avalanche have been presenting excellent performance for ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 2014